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April 2005

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guenter Grossmann <[log in to unmask]>
Date:
Fri, 15 Apr 2005 11:34:21 +0200
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Phil, John

I looked a bit in good ol' Klein Wassink and found his formula for the
growth of intermetallic compounds on Cu surfaces:

d=10^3(exp(-5*10^3/T)t^1/2

d= Thickness of IMC in um
T= Temperature in K
t= time in sec.

The equation can easily be solved for t. Gives a nice Excel spreadsheet
where the time for a given temperature can be estimated a layer of Sn of
a certain thickness needs to be transformed to IMC and will thus make
problems  in soldering. Gives interesting results when Sn 0.8um is
compared with 1.2um thickness.

Guenter



EMPA
Swiss Federal Laboratories  for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

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