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April 2005

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Subject:
From:
Russell Burdick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Russell Burdick <[log in to unmask]>
Date:
Sat, 2 Apr 2005 15:18:59 -0700
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text/plain (54 lines)
You might also verify with your board house that it is indeed silver under
the mask. I've heard of  leaving electrolytic tin on the copper surface,
applying LPI solder mask and then tin stripping the panel to prepare surface
for immersion platings. This may address poor tin stripping issues prior to
mask or poor LPI developing/rinsing prior to final finishing. "For the
record your honor" I have not tried it nor thought of it. I am not that
smart/desperate/daring etc. I wouldn't suggest it either. Best thing is to
fix which ever process that is generating the difficulties. Technical
service from the chemical people is essential at this point.

Russ Burdick

>From: "Stephen M. Vargas" <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              "Stephen M.
>Vargas" <[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] Immersion Silver
>Date: Fri, 1 Apr 2005 07:42:26 -0600
>
>Good Day All:
>
>     A question arose at our factory regarding immersion silver surface
>finish. We recieved boards where the solder masking was applied after the
>immersion silver was applied to the PWB. Are there potential solder mask
>adhesion issues with this? Should the solder mask be applied prior to
>adding the surface finish? Any insight would be appreciated. Thanks.
>
>Regards,
>Steve Vargas
>
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