What Designers Need to Know: Lead Free Initiative for Electronic Assembly
Hosted by Hunter Technology Corporation
May 5-6, 2005 - Santa Clara, CA

Designing printed boards today is more difficult than ever before because of the hot issue of lead free in manufacturing. Not only has the density of the electronic assembly increased, but there are also many changes taking place throughout the entire supply chain regarding the use of hazardous materials and the requirements for recycling. Much of the change is due to the European Union (EU) Directives regarding these issues. Those RoHS directives have caused many suppliers to the industry to rethink their materials and processes. Thus, everyone designing or producing electronics will be affected. 

The "What Designers Need to Know: Lead Free Initiative for Electronic Assembly" workshop will provide an awareness of the lead free changes taking place. The discussions will address the increasingly sophisticated PCB fabrication technologies and how they will incorporate the lead free materials and performance requirements. Challenges include managing the interconnection of both through hole and surface mount at the bare board level. The tolerance characteristics that make sense using the capabilities of today's manufacturing equipment will also be discussed. Attendees will have a unique opportunity to obtain first-hand information on design issues that impact lead free manufacturability. 

The EU requirements will not permit certain material to be included in electronic assembly after July 2006. A component manufacturer who wishes to sell his product to a global community must change the plating on the leads, lands, and balls and the plastic housing of the part will also change. Surface finishes on the mounting surface of the printed board are no longer as robust as they originally were because of this mandate. Since the alternative solutions require increased temperature exposure, the printed board dielectric, the component plastic and several other related features must be re-evaluated. 

This workshop will be held "on location" and each of the topics listed will be discussed and then implemented in a printed board fabrication and assembly facility. IPC is grateful to Hunter Technology Corporation for allowing IPC to present this workshop onsite. 

For a full course description, go to http://www.ipc.org/calendar/LFInitiative_5505/LFInitiative_5505.htm or contact Michelle Michelotti at 847-597-2822.

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