Fred
Contact Pat Goldman, she was involved in the process. [log in to unmask]<mailto:[log in to unmask]>
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: Frederick Miller<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Thursday, April 14, 2005 1:36 PM
Subject: Re: [TN] ENIG/ITO
Does anyone have a sample of the steel board coated with epoxy? That is the first board I ever saw and it was at a Western Electric plant in Kearney NJ.
**************************
Frederick H. Miller PE
Astrolab, Inc.
4 Powder Horn Drive
Warren, NJ 07059
Tel: 732-560-3800
Fax: 732-560-9570
www.astrolab.com<http://www.astrolab.com/>
[log in to unmask]<mailto:[log in to unmask]>
*****************************
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of R Sedlak
Sent: Thursday, April 14, 2005 1:12 PM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] ENIG/ITO
Brian: It is ALMOST Friday, so I am allowed to make inane, (or maybe not so inane) suggestions.... about connecting the two sides of the proposed board...
You are aware that PCB started out with RIVITS as the interconnection between the two sides?
Rudy Sedlak
RD Chemical Company.... Happy almost Friday
Brian T <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Hello TechNetters,
I've been tasked with researching material for a new project. This circuit board would have several unique characteristics. The base material would need to be rigid and transparent (acrylic or polycarbonate?). This double sided board would need a gold finished circuit (ENIG) on the primary side, on which a minimal number a components would mount. On the secondary side would be a pattern consisting of indium tin oxide (ITO). And cost is a concern (as always) as the final product will be disposable, with high production numbers.
I know there are companies that plate or laser etch plastic to create molded interconnect devices (MID), and others that do laser patterning of ITO on plastic. But can both these processes be applied to one device, and is there one company that can do both? Any thoughts on making the interconnection between the two sides (conductive epoxy fill in vias maybe)? Are there any other options?
This is vastly different than the low volume multi-layer FR4 boards our company usually does.
Thanks for any help,
Brian
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