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April 2005

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Thu, 14 Apr 2005 10:46:39 -0700
Content-Type:
text/plain
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text/plain (128 lines)
Had one back in '86 but it was steel which had been enamelled and then a
circuit pattern printed on the top of the glass.

John



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Frederick Miller
Sent: Thursday, April 14, 2005 10:37 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG/ITO


Does anyone have a sample of the steel board coated with epoxy? That is the
first board I ever saw and it was at a Western Electric plant in Kearney NJ.

**************************
Frederick H. Miller PE
Astrolab, Inc.
4 Powder Horn Drive
Warren, NJ 07059
Tel: 732-560-3800
Fax: 732-560-9570
www.astrolab.com
[log in to unmask]
*****************************



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of R Sedlak
Sent: Thursday, April 14, 2005 1:12 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG/ITO


Brian:  It is ALMOST Friday, so I am allowed to make inane, (or maybe not so
inane) suggestions.... about connecting the two sides of the proposed
board...
You are aware that PCB started out with RIVITS as the interconnection
between the two sides?

Rudy Sedlak
RD Chemical Company.... Happy almost Friday

Brian T <[log in to unmask]> wrote:
Hello TechNetters,

I've been tasked with researching material for a new project. This circuit
board would have several unique characteristics. The base material would
need to be rigid and transparent (acrylic or polycarbonate?). This double
sided board would need a gold finished circuit (ENIG) on the primary side,
on which a minimal number a components would mount. On the secondary side
would be a pattern consisting of indium tin oxide (ITO). And cost is a
concern (as always) as the final product will be disposable, with high
production numbers.

I know there are companies that plate or laser etch plastic to create molded
interconnect devices (MID), and others that do laser patterning of ITO on
plastic. But can both these processes be applied to one device, and is there
one company that can do both? Any thoughts on making the interconnection
between the two sides (conductive epoxy fill in vias maybe)? Are there any
other options?

This is vastly different than the low volume multi-layer FR4 boards our
company usually does.

Thanks for any help,
Brian

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