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Subject:	Component Standoff Guidelines/requirements/Specification
From:	"Victor G. Hernandez" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Wed, 13 Apr 2005 09:29:26 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (20 lines)

Fellow TechNetters,

   A while back I was keeping track of massages regarding standoff
clearance.   I do not recall a consensus target number.
Can someone share their experience with me in this matter?   My concern
is with regards to Ball Grid Array devices in which
the solder bump has been elongated to the point of separation.

Victor,

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