Hi Angela, I know that this webcast has already happened.  I was not able
to sign up for it due to a business trip. As IPC designer council
member  and as Kyocera member is it possible to get a copy of this
presentation.  Thank-you.





At 10:17 AM 3/16/2005 -0600, you wrote:
>An Overview of the Newly Released IPC-7351
>
>Wednesday, March 23, 2005
>10:00 am - 11:00 am (CT)
>11:00 am - 12:00 pm (Eastern)
>
>The release of IPC-7351, which covers land pattern design and surface
>mounting, marks a new area in conceptualizing and describing electronic
>assembly. This webcast details the history of land pattern development,
>cooperative efforts with the organizations responsible for component
>standardization and the principles involved in developing robust patterns
>to meet reliability expectations.
>It was clear, almost at the beginning of the standardization process, that
>both the land pattern on the mounting structure and the footprint of the
>component lead/ terminations are integral to good surface mount bonding.
>The third integral part of this triangle is the solder or attachment
>material. However, without a good mounting plat form or a good component
>termination description, the assembly process is often frustrating.
>
>With the move to new alloys and new temperatures in the assembly process,
>everyone asks the same question. What changes must I now make in the
>physical properties of the joint constituents?
>The webcast covers these changes as well as the mathematical model that
>forms the foundation of the land pattern and component attachment
>relationships. It will also discuss how IPC has greatly simplified the
>establishment of a CAD or CAM layout process by establishing a liaison
>with several automated tool providers. Find out more in this revealing
>look at land patterns and the importance of descriptions in a successful
>assembly process.
>
>The webcast will be led by Dieter Bergman, IPC's director of technology
>transfer. Dieter has instructed PCB designers for more than two decades
>and was instrumental in the development of IPC-2221 and many other IPC
>design standards.
>
>The webcast will begin at 10:00 am (Central Time) and concludes at 11:00
>am. To download the registration form, go to
>http://www.ipc.org/calendar/7351Webcast_305/documents/7351Reg.Form.pdf and
>return it to IPC's registration department via fax at 847-615-7105.
>
>
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Thank-you

Mumtaz

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---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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