Hi Blair
We bought some dummy parts and gave it a try. Build a profile board
and give it a go. BGAs are in some ways easier than the big QFPs IMHO.
Same with 0402s, we tried them and found they weren't as bad as one
might expect. Our old reflow oven does BGAs just fine.
As for inspection, we've used x-ray for verification of the process and
we do it if we think there may be a problem, but most of the product
only has the visual inspection using a "look under" tool.
Good luck!
regards,
Graham Collins
Process Engineer,
L-3 Communications Electronic Systems Inc.
Halifax
(902) 873-2000 ext 6215
>>> [log in to unmask] 04/08/05 11:30AM >>>
Happy Friday, Technetters!
OK, now that I've gotten your attention, our Engineering folks have
been trying to drag the manufacturing folks (kicking and screaming) into
the 21st century (or maybe even just the 20th century) in terms of
manufacturing capabilities. We are a low volume high mix OEM, with
limited SMT capabilities. The R&D guys want to use the more
sophisticated stuff, but the old equipment we have just isn't up to the
task. We struggle with 208pin QFPs and other high density devices. They
would like to use smaller components, and possibly even BGAs.
I know for smaller components we would have to upgrade to a better pick
and place machine with more accurate component placement. But for BGAs,
the existing machine may be able to place them, but currently we have no
way to tell how well it worked, other than whether it passed or failed
functional test.
I've seen the "look-under" BGA inspection equipment, but I believe that
we would probably need the X-ray machine to do the job. I've also heard
that our old reflow oven may not even do a good job at reflowing BGAs.
Is X-ray inspection necessary? And will any old reflow oven solder a
BGA?
Thanks,
Blair
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