Does anyone have any real practical experience using tin/silver/copper


(SAC) versus tin copper (SnCu) alloy in a PCB flowsolder machine?





We realise SAC is very much more expensive and has a lower liquidus than


SnCu but we are also getting feedback that dross levels from SAC even


under Nitrogen are unfavourably high.





Any good feedback appreciated - real life experience please, not


supposition!


 





Regards,


Chris


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