That seems like a lot of solder on the leads already, I usually see a few microns. It makes me think even more that the substrate has nothing to do with it. Did you run any of the sodlerability tests? Good think would be to look at the virgin and failed parts with an SEM/EDS from the surface and in the X-section.
Regards,
Vladimir
Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
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-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Qing Gu
Sent: Friday, April 29, 2005 11:03 AM
To: [log in to unmask]
Subject: Re: [LF] Does Ni barrier help soldering?
85Sn15Pb, 12~20um thickness, 25mil pitch QFP, and it seems thicker finish
better than thin.
Qing
> Well, as I've said, I wouldn't think so right away. Do you have more
> information on your component finish/terminals?
>
> Regards,
>
> Vladimir
>
> Vladimir Igoshev, Ph. D.
> Senior Materials Researcher
> Research in Motion
> 451 Phillip St.
> Waterloo, ON, N2L 3X2
>
> Voice: (+1) 519-888-7465, ext. 5283
> Fax: (+1) 519-886-0863
> E-mail: [log in to unmask]
>
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]]On Behalf Of Qing Gu
> Sent: Friday, April 29, 2005 10:54 AM
> To: [log in to unmask]
> Subject: Re: [LF] Does Ni barrier help soldering?
>
>
> We do think that the soldering problem must be related to the high tin
> finish. But some body told me that from the experience, parts with Ni
> barrier get better chance to solder, and that's why I have this question
> in mind.
>
> Qing
>
>> I think there is a good chance that your current substrate material has
>> nothing to do with the problem, so changing it (adding a Ni barrier)
>> won't
>> solve the problem. How do you know that it's not the Sn-rich plating
>> itself that is causing the problem?
>>
>> Regards,
>>
>> Vladimir
>>
>> Vladimir Igoshev, Ph. D.
>> Senior Materials Researcher
>> Research in Motion
>> 451 Phillip St.
>> Waterloo, ON, N2L 3X2
>>
>> Voice: (+1) 519-888-7465, ext. 5283
>> Fax: (+1) 519-886-0863
>> E-mail: [log in to unmask]
>>
>>
>> -----Original Message-----
>> From: Leadfree [mailto:[log in to unmask]]On Behalf Of Qing Gu
>> Sent: Friday, April 29, 2005 10:32 AM
>> To: [log in to unmask]
>> Subject: [LF] Does Ni barrier help soldering?
>>
>>
>> Hi All,
>>
>> We are soldering component with hign tin (above 85%)finish using
>> eutectic
>> solder and having soldering problems such as Non-wetting. If we use
>> component with Ni barrier, will the Ni barrier help soldering? If so,
>> why?
>>
>> Thank you.
>>
>> Qing Gu
>>
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