Dear All

We have been shipping OSP covered PCBs to our customers.There is a component
having 72 pads at 4 sides   dimensions of pads are 480X1500 microns the
distance between the pads are 500 microns. These pads are subjected to cream
solder in customers production. As known that appertures on the stencils are
produces smaller than the pads dimensions to release solder paste on the
pads. By considering these solder can not spread all over the pad during
soldering at customer side so pads have incomplete wetting apperance because
appertures dimensions are smaller than pad dimensions. We have dispute with
our customer about this issue. They want all the pad pitch to be soldered.
So I want to learn about your comment on these incomplete wetting. Is it
always possible to solder all the pad in the customer side.



Yusuf GOMEC
Product Quality Engineer


BASKI DEVRE SAN. ve TIC. LTD. STI.
Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
Tel:0090 216 3901036(4 Line)/4836560(4 Line)
Fax:0090 216 3544941/4913269
Gsm:0090 533 6579897/7480014
Internet: www.baskidevre.com.tr

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