Vladimir and others,
Are you saying that I may not be able to find out
black pad condition on fab before relfow?
re,
Ken Patel
--- Vladimir Igoshev <[log in to unmask]> wrote:
> Yes, after reflow.
> Regards,
> Vladimir
> Sent from my Blackberry Wireless
> Vladimir Igoshev, 519-888-7465 ext.5283
>
>
> -----Original Message-----
> From: TechNet <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Sent: Fri Apr 29 12:17:00 2005
> Subject: Re: [TN] gold vs copper plating on pcb's -
> Black PAD???
>
> All,
> How is to detect black pad? Can it be inspected at
> PCB
> level? I guess no. Is it the after reflow soldering
> phenomena?
>
> Re,
> Ken Patel
>
>
> --- Werner Engelmaier <[log in to unmask]> wrote:
> > Hi Bob,
> > First, with ENIG you do not solder to gold, but to
> > the underlying nickel;
> > Second, soldering to Ni requires more thermal
> > energy, thus higher temperatures, and that is
> really
> > bad news on top of the T-increase necessary for
> > LF-solders;
> > Third, the 'black pad' issue will not go away with
> > LF-solderas,but actually may become worse.
> > Thus, Immersion Ag is a good choice.
> > Werner Engelmaier
> >
> > -----Original Message-----
> > From: Jeffrey Bush <[log in to unmask]>
> > To: [log in to unmask]
> > Sent: Wed, 27 Apr 2005 07:14:42 -0400
> > Subject: Re: [TN] gold vs copper plating on pcb's
> >
> >
> > If you stick with ENIG and do not test Immersion
> > Silver then I am sure
> > you will be doing future testing to combat the
> > issues with ENIG. Monies
> > are being put into the development if silver and
> > several toughed
> > formulas are coming out that have excellent
> > resistance to TC and do not
> > have the issues associated with ENIG. OSP is also
> > seeing some
> > development, but I do not see this as a viable
> > alternative today.
> >
> > Jeffrey Bush
> > Director, Quality Assurance and Technical Support
> >
> > VERMONT CIRCUITS INCORPORATED
> > 76 Technology Drive - POB 1890
> > Brattleboro, Vermont 05302
> > Voice: 802.257.4571.21 Fax: 802.257.0011
> > http://www.vtcircuits.com
> >
> >
> > -----Original Message-----
> > From: Bob Arciolla [mailto:[log in to unmask]]
> > Sent: Tuesday, April 26, 2005 4:41 PM
> > To: [log in to unmask]
> > Subject: [TN] gold vs copper plating on pcb's
> >
> > Good Afternoon all,
> >
> > Our company will be switching over to lead free
> and
> > we have received
> > sample pcb's from one of our vendors and one board
> > has gold (ENIG) for
> > the traces and one has copper (OSP). From some of
> > the emails I have seen
> > on Technet it appears that gold is what most of
> > companies are going to
> > be using? Is this correct or is there some other
> > materials we should be
> > looking into to use? Is the gold more reliable
> than
> > the copper?
> > Any input would be greatly appreciated.
> >
> >
> >
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> > Regards, Bob
> >
> >
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