Subject: | |
From: | |
Reply To: | |
Date: | Fri, 29 Apr 2005 10:14:56 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Dave - I wouldn't expect much difference between the resin of the paste and
the laminate. The glass cloth in the laminate is the hardest thing you will
be drilling through.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Seymour
Sent: Friday, April 29, 2005 8:42 AM
To: [log in to unmask]
Subject: [TN] Via Filler
Group,
Does anyone know if via filler Peters Paste #2361
when cured is harder or softer than the PCB laminate (Nelco 4000-13)?
I have to drill out a few vias by hand for the prototypes and was
wondering if I would see any drill deflection.
Thanks
dave
--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560
Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297
[log in to unmask]
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|