Yes, after reflow.
Regards,
Vladimir
Sent from my Blackberry Wireless
Vladimir Igoshev, 519-888-7465 ext.5283
-----Original Message-----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Fri Apr 29 12:17:00 2005
Subject: Re: [TN] gold vs copper plating on pcb's - Black PAD???
All,
How is to detect black pad? Can it be inspected at PCB
level? I guess no. Is it the after reflow soldering
phenomena?
Re,
Ken Patel
--- Werner Engelmaier <[log in to unmask]> wrote:
> Hi Bob,
> First, with ENIG you do not solder to gold, but to
> the underlying nickel;
> Second, soldering to Ni requires more thermal
> energy, thus higher temperatures, and that is really
> bad news on top of the T-increase necessary for
> LF-solders;
> Third, the 'black pad' issue will not go away with
> LF-solderas,but actually may become worse.
> Thus, Immersion Ag is a good choice.
> Werner Engelmaier
>
> -----Original Message-----
> From: Jeffrey Bush <[log in to unmask]>
> To: [log in to unmask]
> Sent: Wed, 27 Apr 2005 07:14:42 -0400
> Subject: Re: [TN] gold vs copper plating on pcb's
>
>
> If you stick with ENIG and do not test Immersion
> Silver then I am sure
> you will be doing future testing to combat the
> issues with ENIG. Monies
> are being put into the development if silver and
> several toughed
> formulas are coming out that have excellent
> resistance to TC and do not
> have the issues associated with ENIG. OSP is also
> seeing some
> development, but I do not see this as a viable
> alternative today.
>
> Jeffrey Bush
> Director, Quality Assurance and Technical Support
>
> VERMONT CIRCUITS INCORPORATED
> 76 Technology Drive - POB 1890
> Brattleboro, Vermont 05302
> Voice: 802.257.4571.21 Fax: 802.257.0011
> http://www.vtcircuits.com
>
>
> -----Original Message-----
> From: Bob Arciolla [mailto:[log in to unmask]]
> Sent: Tuesday, April 26, 2005 4:41 PM
> To: [log in to unmask]
> Subject: [TN] gold vs copper plating on pcb's
>
> Good Afternoon all,
>
> Our company will be switching over to lead free and
> we have received
> sample pcb's from one of our vendors and one board
> has gold (ENIG) for
> the traces and one has copper (OSP). From some of
> the emails I have seen
> on Technet it appears that gold is what most of
> companies are going to
> be using? Is this correct or is there some other
> materials we should be
> looking into to use? Is the gold more reliable than
> the copper?
> Any input would be greatly appreciated.
>
>
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> Regards, Bob
>
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