LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

April 2005

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET April 2005

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: Solder reflow
From:	"Whittaker, Dewey (AZ75)" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (AZ75)
Date:	Mon, 25 Apr 2005 12:51:52 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

What was the lead finish?
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason
Sent: Monday, April 25, 2005 12:38 PM
To: [log in to unmask]
Subject: [TN] Solder reflow

Good day,
investigation into solder reflow performance reveals components that pull
out of the solder fillet with no damage to the component and the fillet is
left intact as well. Solder that was under the component looks like swiss
cheese with multiple holes.
What part of the reflow is the likely cause, conveyor speed, pre-heat,
reflow heat, or cool down?

Thanks in advance for any help
Jason

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet
NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest Search the archives of
previous posts at: http://listserv.ipc.org/archives Please visit IPC web
site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG