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| Date: | Mon, 11 Apr 2005 12:24:37 -0400 |
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Hi Don:
Check this: http://www.chemguide.co.uk/physical/phaseeqia/snpb.html. Very informative.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Donald Kyle
Sent: Monday, April 11, 2005 10:34 AM
To: [log in to unmask]
Subject: Re: [TN] Pb-Free
Any amount of lead over about 1% will start reducing the melting point to
about 183 C.
So, if after you have formed the solder joint and it contains more than the
above amount of lead, your melting point will be about 183 C. Just like 63/37.
Reliability depends upon what you are worried about. Parts falling off the
board when the solder joint reaches 183 C maybe?
Donald Kyle
At 09:07 AM 4/11/2005, you wrote:
>Does anyone think that 3.5% Pb in a SN96AG4 (aka Pb-free) is abnormal? I
>think it is, but I have doubters here. This was measured by EDX.
>
>Does anyone have any evidence what this does to reliability?
>Specifically mechanical cycling.
>
>Paul Stolar
>Materials/Reliability Engineer
>Manufacturing Reliability Lead Engineer
>Baker Atlas
>713-625-5376
>
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