Any amount of lead over about 1% will start reducing the melting point to
about 183 C.

So, if after you have formed the solder joint and it contains more than the
above amount of lead, your melting point will be about 183 C.  Just like 63/37.

Reliability depends upon what you are worried about.  Parts falling off the
board when the solder joint reaches 183 C maybe?

Donald Kyle

At 09:07 AM 4/11/2005, you wrote:
>Does anyone think that 3.5% Pb in a SN96AG4 (aka Pb-free) is abnormal? I
>think it is, but I have doubters here. This was measured by EDX.
>
>Does anyone have any evidence what this does to reliability?
>Specifically mechanical cycling.
>
>Paul Stolar
>Materials/Reliability Engineer
>Manufacturing Reliability Lead Engineer
>Baker Atlas
>713-625-5376
>
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Donald Kyle C.I.D.+
281-285-7528 voice
281-285-8593 fax
[log in to unmask]
Schlumberger
Sugar Land Product Center (SPC)
Mail Drop MD155-1
155 Industrial Boulevard
Sugar Land, Texas 77478

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