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March 2005

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Subject:
From:
Eric CHRISTISON <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eric CHRISTISON <[log in to unmask]>
Date:
Mon, 7 Mar 2005 09:46:59 -0000
Content-Type:
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John,

I know something about plating but we are not a plating company.

The other thing I should have asked about is quantity.

The biggest difficulty you may have is plating selectively, especially if
the component is 3 dimensional. My experience with plating is of vacuum
deposition plating for EMC protection. We moved away from PC because it did
not give the best adhesion - however it may be OK for your customer's needs.
If you did go for a vacuum deposition process you'd have to arrange for
masking of the component in the same way that you would mask a component if
you painting it. This could be using some kind of tape or a fixture.

I also found that surface finish has only a second order influence on
adhesion. If you have good plating a smooth finish won't cause failure and
vice versa with poor plating. People plate plastic for mirrors and the
plastic substrate has to have a mirror finish...

Sorry I can't be more specific but hope this helps.

Regards,

Eric  Christison
Mechanical Engineer
Consumer & Micro Group - Imaging Division
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF

Tel:     +44 (0)131 336 6165
Fax:    +44 (0)131 336 6001


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Parsons
> Sent: Friday, March 04, 2005 4:58 PM
> To: [log in to unmask]
> Subject: Re: [TN] Conductive Pattern on Lexan?
> 
> 
> With regards to Peters suggestion of silver deposition, I had 
> suggested that to them and I will mention it again.
> 
> Eric, your questions are all good, but I do not have that 
> information at this time.  Is your organization in such 
> things?  Should I hook up my customer with you directly?
> 
> John
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
> Sent: Friday, March 04, 2005 8:34 AM
> To: [log in to unmask]
> Subject: Re: [TN] Conductive Pattern on Lexan?
> 
> How big a component are they talking about and is it flat or 
> 3 dimensional?
> 
> Do they need good adhesion? What sort of environment is this 
> part destined for?
> 
> Regards,
> 
> Eric  Christison
> Mechanical Engineer
> Consumer & Micro Group - Imaging Division
> STMicroelectronics
> 33 Pinkhill
> Edinburgh
> EH12 7BF
> 
> Tel:     +44 (0)131 336 6165
> Fax:    +44 (0)131 336 6001
> 
> 
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
> > Sent: Friday, March 04, 2005 4:21 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Conductive Pattern on Lexan?
> > 
> > 
> > Lexan is GE's generic trade name for their polycarbonate
> > resin family, so there are various grades, probably one would 
> > be OK. A flex circuit manufacturer would be a good place to 
> > start talking as it is likely to be similar process to those 
> > used to make polymer circuitry.
> > 
> > Regards
> > 
> > Mike Fenner
> > Indium Corporation
> > 
> > T: + 44 1908 580 400
> > M: + 44 7810 526 317
> > F: + 44 1908 580 411
> > E: [log in to unmask]
> > W: www.indium.com
> > Pb-free: www.Pb-Free.com
> > 
> > 
> > 
> > 
> > 
> > 
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of John Parsons
> > Sent: Friday, March 04, 2005 4:00 PM
> > To: [log in to unmask]
> > Subject: [TN] Conductive Pattern on Lexan?
> > 
> > 
> > Happy Friday!
> > 
> >  
> > 
> > I have a customer who would like to produce a conductive
> > pattern, preferable with a gold finish on ½ to 1” thick Lexan 
> > or some other clear dielectric. Clear because they want to be 
> > able to see through it and the thickness will be required to 
> > withstand a significant pressure that will be on the surface. 
> > That is all the information I have at present.  
> > 
> >  
> > 
> > Any of you guru’s out there have any ideas/suggestions as to
> > either the feasibility or impossibility?  Offhand I don’t 
> > know if Lexan would stand up to the various processes in the 
> > regular PCB etching/plating processes.  Even suggestions as 
> > to another industry capable of this feat would be appreciated.
> > 
> >  
> > 
> > Regards
> > 
> > John Parsons
> > 
> >  
> > 
> > 
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