The hot plating topic at IPC EXPO was NOT through-hole plating but
BLIND-VIA plating.  There were over 640 million cell phone made last year
with most having two laser-drilled blind vias boards in them!  The
advanced technology is to replace high aspect ratio through hole plating
with small-blind vias stacked on top of buried vias.  The buried vias can
be Via-in-Pad so the need is to have these vias plated solid so that they
are flat for assembly.  The unique property of these new copper plating
baths is that they have very high throwing capability and are suited for
horizontal or moving panel vertical plating equipment.  That would mean
that they probably due very well with high aspect ratio holes also.

Happy Holden
Westwood Associates



Rich Olsen <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/05/2005 09:58 AM
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[TN] Advanced plating






Hello,
        What is being achieved today in advanced through hole plating?
        What is the "State-of the Art"?
        Thicker boards.
        Narrower holes.
        Higher aspect ratios.

        Is this being achieved by newer plating technologies, by doing
different
things with old technologies (longer plating times), or by "Holistic board
manufacture" (Tight lamination, drill, desmear, photo, Mettalization and
plating controls)

Rich Olsen


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