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Date: | Sat, 5 Mar 2005 07:58:13 -0700 |
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Hello,
What is being achieved today in advanced through hole plating?
What is the "State-of the Art"?
Thicker boards.
Narrower holes.
Higher aspect ratios.
Is this being achieved by newer plating technologies, by doing different
things with old technologies (longer plating times), or by "Holistic board
manufacture" (Tight lamination, drill, desmear, photo, Mettalization and
plating controls)
Rich Olsen
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