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March 2005

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Subject:
From:
Genny Gibbard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Genny Gibbard <[log in to unmask]>
Date:
Thu, 31 Mar 2005 16:31:10 -0600
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I am also interested in answers to Alan's second question regarding
reliability.
I never thought about actually changing the balls on a device.  We have a
device that is going Pb free as well, and it is happening quicker than we
are going to be prepared for it.  If this is a reliable option, I will
probably consider this route as well.
People are suggesting reballing co's without any other comments regarding
Alan's reason for doing the process.  Does that mean that it is common
practice to change balls for this sort of reason?

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 31-Mar-05 1:52 PM
To: [log in to unmask]
Subject: [TN] BGA Reballing


Hello Technetters:

I have a .8mm uBGA (88 balls, SDRAM) that currently is only available with
lead-free (SAC) balls.  I'm not ready to go lead-free on this board, so I
would like to get the bga reballed with Sn63.

Looking for recommendation on reballing companies that have a quick
turn-around-time, and competitive pricing.

Also, does anybody have experience / knowledge on the reliability of
putting a Sn ball on a leveled pad on a bga that has a SAC coating? Should
I be concerned?

As always, thanks in advance,


Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
500 Riverpark Drive
Mail Stop NR500 1-1
North Reading, MA 01864
Tel: 978-370-1726
Fax: 734-661-5352
Pager: 888-561-6485

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