Hi - I hope this helps,
RoHS Compliance: The European Commission will formally adopt the following
waivers (exemptions) some time next month (April):
The New Waivers (Exemptions) will be:
- Lead used in compliance-pin VHDM (very high density medium) connector
systems
- Lead as coating material for thermal conduction module C-ring
- Lead and cadmium in optical and filter glass
- Lead in solders consisting of more than two elements for the connection
between the pins and the package of microprocessors with a lead content of
more than 85% in proportion to tin-lead content - exemption until 2010
- Lead in high melting temperature solders (I,e, tin-lead solder alloys
containing more than 85% lead) and any lower melting temperature solder
required to be used with a high melting temperature solder to complete a
viable electrical connection
- Lead in solders to complete a viable electrical connection internal to
certain integrated circuit packages (Flip Chips) - exemption until 2010.
Best regards,
Paula Esty
Senior Environmental Systems Specialist
Capaccio Environmental Engineering, Inc.
Voice: (508) 970-0033 ext. 28
Fax: (508) 970-0028
www.capaccio.com * www.iso14000.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Gregory
Sent: Thursday, March 31, 2005 2:56 PM
To: [log in to unmask]
Subject: Re: [TN] Almost RoHS compliant??
Hi Dave!
This is what I found:
The following changes and additions to the list of exemptions within
the RoHS Annex have been adopted and should enter the official
Journal in February or March.
Paragraph 7 previously read:
"7. Lead in high melting temperature type solders (i.e. tin-lead
solder alloys containing more than 85 % lead),
lead in solders for servers, storage and storage array systems
(exemption granted until 2010),lead in solders for network
infrastructure equipment for switching, signalling, transmission as
well as network management for telecommunication,lead in electronic
ceramic parts (e.g. piezoelectronic devices)."
This will be replaced with:
"7. Lead based alloys containing 85% by weight or more lead,lead in
solders for servers, storage and storage array systems network
infrastructure equipment for switching, signalling, transmission as
well as network management for telecommunications,lead in electronic
ceramic parts (e.g. piezoelectronic devices)."
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
|---------+---------------------------->
| | Dave Seymour |
| | <dave.seymour@CAT|
| | APULT.COM> |
| | Sent by: TechNet |
| | <[log in to unmask]>|
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| | |
| | 03/31/2005 01:29 |
| | PM |
| | Please respond to|
| | TechNet E-Mail |
| | Forum; Please |
| | respond to Dave |
| | Seymour |
| | |
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| To: [log in to unmask]
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| cc:
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| Subject: [TN] Almost RoHS compliant??
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<>
A IC vendor, when questioned about a particular BGA part we are using
made the following statement:
"This BGA is almost RoHS compliant today. It uses 90/10 Pb/Sn spheres
and bumps
which meet RoHS exemption requirements. However, to be fully RoHS
compliant, we must switch from high-Pb to no-Pb capacitor attach. This
<>may happen in ~2006. There are no plans to further modify the this BGA
package."
Question #1 - Is there an exemption to the RoHS rules with reguards to
high temp lead
solders?
--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560
Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297
[log in to unmask]
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