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March 2005

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Subject:
From:
Stephen Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 31 Mar 2005 13:56:21 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (139 lines)
Hi Dave!

This is what I found:
                                                                            
                                                                            
                                                                            
                                                                            
                                                                            
      The following changes and additions to the list of exemptions within  
      the RoHS Annex have been adopted and should enter the official        
      Journal in February or March.                                         
                                                                            
                                                                            
      Paragraph 7 previously read:                                          
                                                                            
                                                                            
      "7. Lead in high melting temperature type solders (i.e. tin-lead      
      solder alloys containing more than 85 % lead),                        
      lead in solders for servers, storage and storage array systems        
      (exemption granted until 2010),lead in solders for network            
      infrastructure equipment for switching, signalling, transmission as   
      well as network management for telecommunication,lead in electronic   
      ceramic parts (e.g. piezoelectronic devices)."                        
                                                                            
                                                                            
      This will be replaced with:                                           
                                                                            
                                                                            
      "7. Lead based alloys containing 85% by weight or more lead,lead in   
      solders for servers, storage and storage array systems network        
      infrastructure equipment for switching, signalling, transmission as   
      well as network management for telecommunications,lead in electronic  
      ceramic parts (e.g. piezoelectronic devices)."                        
                                                                            
                                                                            
                                                                            



Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX


|---------+---------------------------->
|         |           Dave Seymour     |
|         |           <dave.seymour@CAT|
|         |           APULT.COM>       |
|         |           Sent by: TechNet |
|         |           <[log in to unmask]>|
|         |                            |
|         |                            |
|         |           03/31/2005 01:29 |
|         |           PM               |
|         |           Please respond to|
|         |           TechNet E-Mail   |
|         |           Forum; Please    |
|         |           respond to Dave  |
|         |           Seymour          |
|         |                            |
|---------+---------------------------->
  >--------------------------------------------------------------------------------------------------------------|
  |                                                                                                              |
  |       To:       [log in to unmask]                                                                              |
  |       cc:                                                                                                    |
  |       Subject:  [TN] Almost RoHS compliant??                                                                 |
  >--------------------------------------------------------------------------------------------------------------|




<>
A IC vendor, when questioned about a particular BGA part we are using
made the following statement:

"This BGA is almost RoHS compliant today. It uses 90/10 Pb/Sn spheres
and bumps
which meet RoHS exemption requirements. However, to be fully RoHS
compliant, we must switch from high-Pb to no-Pb capacitor attach. This
<>may happen in ~2006. There are no plans to further modify the this BGA
package."

Question #1 - Is there an exemption to the RoHS rules with reguards to
high temp lead
 solders?

--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560

Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297

[log in to unmask]



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