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March 2005

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guenter Grossmann <[log in to unmask]>
Date:
Thu, 31 Mar 2005 09:11:42 +0200
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Russ

SnPb HASL soldered with SnAgCu works  fine. At least it alloys. The Pb
is found as contamination in the intermetallics between the Sn dendrites
of the Pb free solder. We are right now analysing samples. What we found
is that the Pb doesn't occur pure but forms an alloy with the silver of
the solder. The whole thing becomes somewhat complicated since
intermetallic SnAgPb and AgCuPb phases occur that are not found in the
literature. However, fascinating metallurgy.


Best regards

Guenter

EMPA
Swiss Federal Laboratories  for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

>>> [log in to unmask] 30.03.2005 14:19:16 >>>
Good Morning Technet,

I am at the early stages of learning about lead free solder as an
alternative option to our current tin/lead solder HASL.

Is there anyone out there who can comment about their experiences?

Currently I have no customers requesting this process, but I need to
be
ahead of this need when feasible.

Vendors have provided both sides, yes PCB makers are doing it and a
large
PCB maker tried it and discontinued using it.

Thanks in advance.

Russ Burdick, trying to lessen the HASL hassle

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