One of my former saltmines was a laser cutting house, mostly for ceramics,
but we did do "softstrates " like FR4 et.
It works well and once the laser is tuned in correctly quite complex shapes
can be done.
Most of the work we did though was rectification where scoring or mechanical
cutting had been poorly implemented or specified. It was always amazing how
often we were presented with fully assembled boards where no one had noticed
that scoring or routing had not been done right up till it came time to
break out the panels. (And how soon could we do all the remaining
unassembled ones)
More generally: for FR4 and in particular the high frequency substrate types
you need good vision systems or be prepared to re-adjust by hand during the
cut as the accuracy /stability of the substrate means that if you cut to
drawing then you can be in the "wrong place " with respect to board features
on multi ups /larger boards. This is more a function of the accuracy of the
X-y tables etc than the laser though. That is just a near dimensionless
blade.
The real down side is cost, you pay for machine time and lasering can be
slow compared to conventional methods. For rectification, small runs,
complex shapes, small size parts - or best all three - lasering is easy to
justify, for more usual stuff it's a little harder.
Hope this helps a bit
Regards
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Atkinson, Neil
Sent: Tuesday, March 01, 2005 8:45 AM
To: [log in to unmask]
Subject: [TN] Laser Cutting PCBs
Does anyone out there have experience (good or bad) of depanelising FR1 PCBs
using lasers?
It seems like a really neat solution, no dust etc but I have not seen any
companies using this technology.
Neil
_____________________________
Neil Atkinson
Quality Manager
UK-NSI Co. Ltd.
Merse Road, North Moons Moat,
Redditch, Worcs. B98 9HL, U.K.
Tel: +44 (0) 1527 585055
Fax: +44 (0) 1527 585025
E-mail: [log in to unmask]
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