What should the surfaces cosmetically look like off the solder free HAL
machine? Bright and shiny as our HASL? If not, what is the indicator that
quality-wise the process is nearing the edge of acceptability?

Are your customers well versed in the assembly of boards with the lead free
solder finish? What types of solderability issues might I encounter if a
customer has difficulty and "suspects" that it is a board problem compared
to an assembly problem? (there is always a money aspect to every
situation...)?

I do understand that as a new process competing with an established one it
will garner its own implementation issues. Operators could unwittingly apply
the known guidelines of HASL and resist the new process as "not like the
good old stuff".

Russ

>From: Pete Lymn <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
>To: [log in to unmask]
>Subject: Re: [TN] Lead free solder HAL
>Date: Wed, 30 Mar 2005 14:38:26 +0100
>
>We have been working with lead free alloys in HASL machines since '98 and
>have been leveling panels commercially for about 5 years. What would you
>like to know?
>
>-----Original Message-----
>From: Russell Burdick [mailto:[log in to unmask]]
>Sent: 30 March 2005 01:19 PM
>To: [log in to unmask]
>Subject: [TN] Lead free solder HAL
>
>
>Good Morning Technet,
>
>I am at the early stages of learning about lead free solder as an
>alternative option to our current tin/lead solder HASL.
>
>Is there anyone out there who can comment about their experiences?
>
>Currently I have no customers requesting this process, but I need to be
>ahead of this need when feasible.
>
>Vendors have provided both sides, yes PCB makers are doing it and a large
>PCB maker tried it and discontinued using it.
>
>Thanks in advance.
>
>Russ Burdick, trying to lessen the HASL hassle
>
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