TECHNET Archives

March 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, jbrusse <[log in to unmask]>
Date:
Wed, 30 Mar 2005 07:54:11 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (55 lines)
Bill Brooks inquired about assorted standards that address workmanship
criteria for solder terminals.  The NASA Workmanship Standards www site
provides access to a handful of NASA stds including NASA-STD-8739.3 for
"Soldered Electrical Connections"
         http://workmanship.nasa.gov/wkstds_nasa.jsp

The site also includes a very informative "Inspection Pictorial Reference"
derived from a variety of sources including NASA, IPC and other
organizations.  This reference provides illustrations and photos of a wide
range of electronics assembly workmanship practices including citation of
acceptance/rejection criteria within the NASA std.  Many examples of solder
terminal applications are included as well as examples of conformal
coat/staking, crimp connections, fiber optic assembly, et al.
         http://workmanship.nasa.gov/insp.jsp  ( read the
description/disclaimer of this "inspection pictorial reference" )
         http://workmanship.nasa.gov/lib/insp/2%20books/frameset.html  ( to
open the actual pictorial reference )

Cheers,

Jay Brusse
QSS Group, Inc at NASA Goddard Space Flight Center
----
Date:    Tue, 29 Mar 2005 09:00:26 -0800
From:    "Brooks,Bill" <[log in to unmask]>
Subject: Re: Solder Terminals
Hi Robert,
Yes... I recall the acceptability of cracks in terminals and eyelets...
Thanks for the reminder. It's been a long time since I have had to deal with
them. Your last comment on PTH swaging of terminals... I thought they didn't
allow that in the Mil Specs... there was an issue with damage to the PTH I
think... We always added multiple vias around any non-plated or plated
mechanical hole that was used for ground and/or mounting or if the board
was under any mechanical compression so as to guarantee that the continuity
of the pads on top to the planes and pads on the bottom was maintained by a
via free of mechanical compression... regardless of any single failure in a
mounting or swaged terminal hole. It was just 'good insurance'.
Do you have the specific spec numbers for those? I'd like to look at them
again.
Best regards,
Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2