Just a thought, add some flux and reheat the joint without adding any more solder. As lance says, the paste probably did not fully reflowed.
        Regards,
        Ramon
	

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Lance Mayes
Sent: Tuesday, March 29, 2005 1:27 PM
To: [log in to unmask]
Subject: Re: [TN] SC79 Package Soldering Issues


Hi Karen;
Could this be an issue with the application process of the solder paste?
Have they considered the aperture in the screening, or the size of the
footprint of the pad?  Could it also be an issue with the temperature
exposure limits?  We have an issue at times and it sometimes comes down to
the amount of time the component was exposed to ambient heat.
These are just a few things to get the big dawgs to snag the bone.


                        P.  Lance Mayes CIT
                        Mfg. Trainer



Karen Walters <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/29/05 08:40 AM
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Subject
[TN] SC79 Package Soldering Issues






Has anyone ever had soldering issues with the SC79 packages.

A customer currently has parts soldered to the board.  When they test the
parts, some of the parts do not get good power out.  When the customer
applies more solder the parts achieve the proper power out.  My thoughts
are that the component is floating above the solder and not properly
attached to the board.  Has anyone else ever had this problem.

Please advise.

Thanks

(Embedded image moved to file: pic22022.pcx)

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