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March 2005

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Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Mon, 28 Mar 2005 08:53:07 -0800
Content-Type:
text/plain
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text/plain (58 lines)
Is that air temp or the PCB temp of the heat spreader pad?

Paul Edwards
Process Engineering
[log in to unmask]
Tel: 408-433-4700
FAX: 408-433-9988
Surface Art Engineering
81Bonaventura Dr.
San Jose, CA 95134
DUNS: 944740570
CAGE/NCAGE: 1XZ48

-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Monday, March 28, 2005 8:42 AM
To: [log in to unmask]
Subject: Re: [TN] QFP w/heatspreader co-planarity

In a message dated 3/28/05 10:55:33, [log in to unmask] writes:
> The temperatures that we are running at are at 214-221C.
> This is clearly not enmough for a large component containing a heat
spreader.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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