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March 2005

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From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Mon, 28 Mar 2005 08:45:35 -0500
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            Hi Bill:
          This board thickness is in between standard size terminals, so it is an issue. We are using the Cambion tool recommended for the terminal. Nevertheless, we have some very old terminals that will not crack no matter what and some new ones that will crack very easily.  How tight are the terminals supposed to be swaged on the boards?
           Regards,
           Ramon
         

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, March 28, 2005 8:34 AM
To: TechNet E-Mail Forum; Dehoyos, Ramon
Subject: Re: [TN] Solder Terminals



Ramon, 

Can  you indicate what the source of the tooling is? Is it exactly the correct tooling for the terminal in question? 

Another area I would look at is board thickness. Terminals have been typically made for standard thickness of board materials such as .031, .062, etc. I've had problems with boards coming in thinner than what the terminal was made for. This makes the swage operation more difficult to do without cracks and splits. 

I've even used a small thin solderable washer on the turret side of a terminal in order to have the proper thickness so the terminal will swage properly. 

Bill Kasprzak
Moog Inc
Process Engineer, Electronic Assembly 



"Dehoyos, Ramon" <[log in to unmask]> 
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03/28/2005 08:16 AM 


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[TN] Solder Terminals

	




        Hi Technetters:
     I would like to know if anybody has experienced difficulties in flaring the flange of solder terminals. On J-std-001C 6.2.3 it states that the angle of flare shall be between 35 and 120 deg. Some terminals crack even if they are flared at 36 deg.  Other terminals can be flared at 120 deg and not crack. I suspect that the plating finish has a lot to do with it. 
       Regards,
       Ramon

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