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| From: | |
| Reply To: | |
| Date: | Mon, 28 Mar 2005 07:32:58 -0600 |
| Content-Type: | text/plain |
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Rich,
That should be: [log in to unmask]
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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| | David Douthit |
| | <[log in to unmask]>|
| | Sent by: TechNet |
| | <[log in to unmask]>|
| | |
| | |
| | 03/26/2005 02:48 |
| | PM |
| | Please respond to|
| | TechNet E-Mail |
| | Forum; Please |
| | respond to David |
| | Douthit |
| | |
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| To: [log in to unmask] |
| cc: |
| Subject: Re: [TN] Surface Contamination on Electroless Copper |
>--------------------------------------------------------------------------------------------------------------|
Rich,
Send a picture of it to Steve Gregory at: [log in to unmask]
He can post it on his web site and then we can help you!
David A. Douthit
Manager
LoCan LLC
Rich Olsen wrote:
>Hi,
>
> Has anyone seen the following?
> Surface contamination on top of electroless copper.
> It prevents plating and subsequent etching.
> It is both under the resist and in exposed areas during pattern
plate and
>etch.
> It is small on the order of a mil or two, but there can be lots of
it.
> It seems to be in streaks, a spattered appearance.
>
>thanks,
>Rich
>
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