You may also check/verify that the DI water rinse prior to drying is up to
snuff. Not just the feed water but also when a basket is just leaving the
tank. Unfortunately, a nice clean rinse tank can attract "dirty" hands on
the wet floor. The oven used for drying is often another place for other
items to be dried, what has it been used for lately? Last but not least is
moving the hot panels into a controlled environment to cool instead of being
left on the wet floor for exposure to all sorts of chemicals in the air.

Oh, did I mention anti-tarnish bath? Check that it's been changed on it's
normal schedule and is in operating range.

Russ Burdick


>From: R Sedlak <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              R Sedlak
><[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] Surface Contamination on Electroless Copper
>Date: Sat, 26 Mar 2005 17:28:00 -0800
>
>Rich:  This contamination is not evident before applying photoresist?
>
>If that is the case, it would suggest that the problem is photoresist
>"locking on" to the Copper.
>Since the problem appears to be everywhere, it is probably caused by
>something before exposure.   Checked your lamination temperatures lately?
>Changed the way you prepare the Copper for photoresist?  Changed
>electroless Copper chemistry?
>
>Rudy Sedlak
>RD Chemical Company
>
>Rich Olsen <[log in to unmask]> wrote:
>Hi,
>
>Has anyone seen the following?
>Surface contamination on top of electroless copper.
>It prevents plating and subsequent etching.
>It is both under the resist and in exposed areas during pattern plate and
>etch.
>It is small on the order of a mil or two, but there can be lots of it.
>It seems to be in streaks, a spattered appearance.
>
>thanks,
>Rich
>
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