Rich:  This contamination is not evident before applying photoresist?

If that is the case, it would suggest that the problem is photoresist "locking on" to the Copper.
Since the problem appears to be everywhere, it is probably caused by something before exposure.   Checked your lamination temperatures lately?  Changed the way you prepare the Copper for photoresist?  Changed electroless Copper chemistry?

Rudy Sedlak
RD Chemical Company

Rich Olsen <[log in to unmask]> wrote:
Hi,

Has anyone seen the following?
Surface contamination on top of electroless copper.
It prevents plating and subsequent etching.
It is both under the resist and in exposed areas during pattern plate and
etch.
It is small on the order of a mil or two, but there can be lots of it.
It seems to be in streaks, a spattered appearance.

thanks,
Rich

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