TECHNET Archives

March 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Wed, 23 Mar 2005 16:25:57 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (78 lines)
Believe this is an issue with the immersion gold bath - there if
probably just extraneous AU without a NI underplate?

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: Colin McVean [mailto:[log in to unmask]] 
Sent: Wednesday, March 23, 2005 3:27 PM
To: [log in to unmask]
Subject: [TN] Nickel Gold "step" plating

Hi to all,

 

We've just completed a batch of Polyimide multilayer PCB's and Ni/Au'd
as our solderable finish. 

We have noticed that the Ni/Au has plated onto and around the pads, and
joined up some quad pack pads.

I seem to recall something about Zinc Octanoate acid leaching out from
the surface of the Polyimide, which acts as a catalyst for the solution
to get a grip and plate onto what is bare substrate, or have I got the
wrong end of a long stick?

Would a UV bump lock the substrate surface prior to the finish, or are
there other remedies? (we already IR bake resist at upto 150oC prior to
the application of Ni/Au)

 

Colin McVean

Production Manager

Artetch Circuits Limited

Tel: 01903 725365

 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2