any reference are welcome.  Thanks IngeMar.  I only found one paper
regarding the topic.
http://spie.org/scripts/abstract.pl?bibcode=2002SPIE.4637..445H&page=1&qs=sp
ie
Thanks again.
Best regards,
                         jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Monday, March 21, 2005 2:50 AM
To: [log in to unmask]
Subject: Re: [TN] laser ablation failure analysis


we tried many years ago, but found it to be too slow a method. In our case
we tried making very fine holes in ceramics and metals. E.g.  'drilling' a 5
mm hole in a thin Kovar sheet took half an hour per hole. We used a pulsed
CO2 laser and the evaporation speed was approx. 0.01 um per shot. With
higher beam power, the speed will increase of course. The trick is to get as
high power as possible with as short time as possible, to describe the
process in a simplified way. You have a lot of companies in the US who know
all about laser ablation. I can dig in my old reports, but laser specialist
as you are yourself, you will have no help from my old, dusty papers...if I
ever find them. A glimpse can be found in this short article:

http://ej.iop.org/links/q15/sKKkELmvG5lvcCZDfiI0vQ/d706l3.pdf

and I think Precision Lab will fill in the rest you need. Let me know about
your result, sweet doctor Bean...sorry..Beam.

Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]
Sent: den 18 mars 2005 15:34
To: [log in to unmask]
Subject: [TN] laser ablation failure analysis


Anyone has experience on laser ablation decap of components?  I saw some
very nice photo of localized decap components, PBGA to be specific, it
decaped one section of the wire bonded part (approx. 1/16 of the chip
location).  What is the equipment? YAG? what is the power?  who is the
equipment maker in the field?  Any recommendation or information on the
methodology?  Thank you very much for all your help.
Best regards,
                             jk

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