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March 2005

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From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Fri, 18 Mar 2005 09:53:16 -0500
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        Try this one
        http://www.apsgold.com/



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Mcmaster, Michael
Sent: Thursday, March 17, 2005 6:25 PM
To: [log in to unmask]
Subject: Re: [TN] Reflow oven and surface mount equipment infor request


Have you looked at some of the batch-type ovens?  I know of APM and Advanced
Techniques that make these types of ovens.  I guess it depends on how low
your volume is.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hughes, Chris
Sent: Monday, February 28, 2005 9:00 AM
To: [log in to unmask]
Subject: Re: [TN] Reflow oven and surface mount equipment infor request

To all tech netters.

Good afternoon

Does anyone know of any companies that manufacture or supply small reflow
ovens for lead free, and surface mount for pick and place - low volume
around 80-100 reels for prototype purposes?

It seems that the new lead free equipment on the market is focusing on high
volume, and it very costly.

Any advice or pointers are much appreciated

Chris

Christopher Hughes
Environmental Scientist 
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard
Sent: 26 February 2005 20:05
To: [log in to unmask]
Subject: Re: [TN] Planar Transformer construction on circuit boards

----- Original Message -----
From: "Phil Nutting" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, February 25, 2005 11:05 AM
Subject: [TN] Planar Transformer construction on circuit boards


> This is for the SMT process people. We
> Good Friday Afternoon,
>
> This is for the SMT process people. We are making a surface mount board
> that includes a planar transformer.  If I take two sections of board and
> have SMT style pads to mount one board to the other will I experience
> reflow problems because the solder pads will be separated (a gap) by two
> thicknesses of LPI mask?
>

Phil,
Maybe I shouldn't answer since I'm not an SMT process person, but I made
similar boards to adapt a thinner SOIC into a wider SOIC space.  I don't
remember if they ever reached the reflow stage (I think they did) but I know
the hand assembled ones worked like a charm.  I would think if your boards
were bonded together and maybe edge plated there would be no problem.
Good luck,
Richard

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