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March 2005

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Subject:
From:
Joyce Koo <[log in to unmask]>
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Date:
Fri, 18 Mar 2005 09:33:56 -0500
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Anyone has experience on laser ablation decap of components?  I saw some
very nice photo of localized decap components, PBGA to be specific, it
decaped one section of the wire bonded part (approx. 1/16 of the chip
location).  What is the equipment? YAG? what is the power?  who is the
equipment maker in the field?  Any recommendation or information on the
methodology?  Thank you very much for all your help.
Best regards,
                             jk

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