Hi Chris,
We have Essemtec machines (www.essemtec.com). I think we bought the
whole line (solder paste machine, pick and place machine, and reflow
oven for around $70K. We use it for our low volume runs. It is
excellent for that. According to the technician, it will work for
Lead-Free applications. I think it will place around 15K passive
components an hour. We can normally run about 200 small boards (250
components each) in 6 hours through the entire process. The machine
does have some inhibiting restrictions. It can place components down to
0402, but the components have to be .2" or less in height. So you can
forget about placing those electrolytic caps! We have to hand place
them into the solder paste before we put them into the reflow oven.
Have a good one!
Clover Baker
PCB Designer, C.I.D.
McDowell Research Limited
Waco, Texas
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mcmaster, Michael
Sent: Thursday, March 17, 2005 5:25 PM
To: [log in to unmask]
Subject: Re: [TN] Reflow oven and surface mount equipment infor request
Have you looked at some of the batch-type ovens? I know of APM and
Advanced
Techniques that make these types of ovens. I guess it depends on how
low
your volume is.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hughes, Chris
Sent: Monday, February 28, 2005 9:00 AM
To: [log in to unmask]
Subject: Re: [TN] Reflow oven and surface mount equipment infor request
To all tech netters.
Good afternoon
Does anyone know of any companies that manufacture or supply small
reflow
ovens for lead free, and surface mount for pick and place - low volume
around 80-100 reels for prototype purposes?
It seems that the new lead free equipment on the market is focusing on
high
volume, and it very costly.
Any advice or pointers are much appreciated
Chris
Christopher Hughes
Environmental Scientist
[log in to unmask]
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard
Sent: 26 February 2005 20:05
To: [log in to unmask]
Subject: Re: [TN] Planar Transformer construction on circuit boards
----- Original Message -----
From: "Phil Nutting" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, February 25, 2005 11:05 AM
Subject: [TN] Planar Transformer construction on circuit boards
> This is for the SMT process people. We
> Good Friday Afternoon,
>
> This is for the SMT process people. We are making a surface mount
board
> that includes a planar transformer. If I take two sections of board
and
> have SMT style pads to mount one board to the other will I experience
> reflow problems because the solder pads will be separated (a gap) by
two
> thicknesses of LPI mask?
>
Phil,
Maybe I shouldn't answer since I'm not an SMT process person, but I made
similar boards to adapt a thinner SOIC into a wider SOIC space. I don't
remember if they ever reached the reflow stage (I think they did) but I
know
the hand assembled ones worked like a charm. I would think if your
boards
were bonded together and maybe edge plated there would be no problem.
Good luck,
Richard
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