An Overview of the Newly Released IPC-7351 
 
Wednesday, March 23, 2005
10:00 am - 11:00 am (CT)
11:00 am - 12:00 pm (Eastern)
 
The release of IPC-7351, which covers land pattern design and surface mounting, marks a new area in conceptualizing and describing electronic assembly. This webcast details the history of land pattern development, cooperative efforts with the organizations responsible for component standardization and the principles involved in developing robust patterns to meet reliability expectations. 
It was clear, almost at the beginning of the standardization process, that both the land pattern on the mounting structure and the footprint of the component lead/ terminations are integral to good surface mount bonding. The third integral part of this triangle is the solder or attachment material. However, without a good mounting plat form or a good component termination description, the assembly process is often frustrating. 
 
With the move to new alloys and new temperatures in the assembly process, everyone asks the same question. What changes must I now make in the physical properties of the joint constituents? 
The webcast covers these changes as well as the mathematical model that forms the foundation of the land pattern and component attachment relationships. It will also discuss how IPC has greatly simplified the establishment of a CAD or CAM layout process by establishing a liaison with several automated tool providers. Find out more in this revealing look at land patterns and the importance of descriptions in a successful assembly process. 
 
The webcast will be led by Dieter Bergman, IPC's director of technology transfer. Dieter has instructed PCB designers for more than two decades and was instrumental in the development of IPC-2221 and many other IPC design standards. 
 
The webcast will begin at 10:00 am (Central Time) and concludes at 11:00 am. To download the registration form, go to http://www.ipc.org/calendar/7351Webcast_305/documents/7351Reg.Form.pdf and return it to IPC's registration department via fax at 847-615-7105. 
 

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