We use a plasma CF4 hole prep system for LCP similar to PTFE.  In
initial testing of the LCP substrates, we had adequate adhesion without
plasma and began to use it to help in cleaning interconnects in mixed
builds.  This is likely a function of you deposition system that may
need a pre-treatment to micro-roughen the surface prior to deposition.
A Tetra-etch maybe helpful in this case, or some other type of sodium
prep chemistry.

  

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: Eric CHRISTISON [mailto:[log in to unmask]] 
Sent: Wednesday, March 16, 2005 6:41 AM
To: [log in to unmask]
Subject: [TN] Plating LCP - delamination

There may be some board manufacturers out there who can help me.

I'm currently trying to put an EMC shield on an component moulded in
LCP. I
find that I can use a vapour deposition to do this but I get adhesion
failures because small areas of the top layer of the polymer delaminate
from
the bulk of the moulding.

When LCP is plated in PCB substrates does the same problem occur or is
the
delamination being caused by the deposition process damaging the
substrate?

What is the normal plating recipe in the PCB industry for LCP anyway and
what adhesion test would be specified?

Regards,

Eric  Christison
Mechanical Engineer
Consumer & Micro Group - Imaging Division
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF

Tel:     +44 (0)131 336 6165
Fax:    +44 (0)131 336 6001

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------