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March 2005

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Subject:
From:
Jason Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jason Gregory <[log in to unmask]>
Date:
Mon, 14 Mar 2005 09:49:41 -0600
Content-Type:
text/plain
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text/plain (60 lines)
Answer is either mini-stencil solder paste or flux the areas with paste
flux, then place BGA and reflow. I would go with paste flux (AIM WS300 or
equivalent).

Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)212-0844 cell
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Thornton White
Sent: Monday, March 14, 2005 9:26 AM
To: [log in to unmask]
Subject: [TN]


Hi All.

We have a customer who wants us to place BGA's for them on otherwise
comletely loaded PCB's.
Problem is, the BGA apertures were missed from their stencil.

Is it at all possible to load a BGA straight on to an unpasted (gold finish)
card? What are the quality implications?
Assuming the answer to above is NO, does anyone have UK contacts for BGA
mini-stencils

Any advice would be appreciated.

Thanks in advance.
Thornton

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