How appropriate. I re-boot my computer and see David's comments, which I
agree with.
Since this is Friday, I must digress and defend my spelling.
It is the 70s and an African-American friend[ I only distinguish the
difference to add clarity to this point, because a friend is a friend even
if he's English( just kidding Graham)] and I meet at the coffee machine in
the morning and he is complaining about he must be getting to old to play
sports anymore and put up with all the pain. I told him " Time wounds all
heals". He said " Are you calling me a heel"? I said" Why no( drum roll,
please), you're a sole, Brother.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Douthit
Sent: Thursday, March 10, 2005 5:29 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Reliability Test Protocol


Bob,

That's the whole idea! There are none. There some recommendation that
are very general in nature but there is no longer a "one size fits all"
testing standard. You must determine the end use environmental
conditions and life warranty requirements for each product and test
accordingly. You must learn to correlate testing to field conditions
(not easy - you need a lot of experience).
This is causing serious soul (sole for Dewey) searching for Pb free builds!

Good luck!

David A. Douthit
Manager
LoCan LLC

bob wettermann wrote:

>Dear Technetters:
>
>In reviewing the myriad of BGA reliability tech papers there seems to be
little commonality in the type of test protocols. There are tests that are
industry specific, device vendor specific and customer specific.
>
>What guidance in terms of minimum mechanical solder joint strength and
reliability testing would the knowledgeable designers (for CLASS II
products)have for us? (We are NOT designers of circuit boards, systems or
devices). Any test protocol standards? What would be the acceptance criteria
for pass/fail be? What type of measurements would be required as a minimum?
>
>Best Regards
>Bob Wettermann
>
>
>Bob Wettermann
>
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