Bob,

That's the whole idea! There are none. There some recommendation that
are very general in nature but there is no longer a "one size fits all"
testing standard. You must determine the end use environmental
conditions and life warranty requirements for each product and test
accordingly. You must learn to correlate testing to field conditions
(not easy - you need a lot of experience).
This is causing serious soul (sole for Dewey) searching for Pb free builds!

Good luck!

David A. Douthit
Manager
LoCan LLC

bob wettermann wrote:

>Dear Technetters:
>
>In reviewing the myriad of BGA reliability tech papers there seems to be little commonality in the type of test protocols. There are tests that are industry specific, device vendor specific and customer specific.
>
>What guidance in terms of minimum mechanical solder joint strength and reliability testing would the knowledgeable designers (for CLASS II products)have for us? (We are NOT designers of circuit boards, systems or devices). Any test protocol standards? What would be the acceptance criteria for pass/fail be? What type of measurements would be required as a minimum?
>
>Best Regards
>Bob Wettermann
>
>
>Bob Wettermann
>
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