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March 2005

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Subject:
Re: Additive Process For PCB Fabrication.
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Wed, 9 Mar 2005 12:44:22 -0800
Content-Type:
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Murulidhara:

It may seem presumptous of me to say this, but I have never been known for being shy..... The additive process for making PCB is quite difficult, and technically very challenging, and the bottom line is that if you have to ask how it is done, you probably should not even be considering doing it.

The additive process plates the copper conductors up from the bare laminate using electroless Copper plating.  You must know how to formulate your own electroless Copper plating baths to do this properly, as most (all?) of the electroless copper plating baths sold today have "anti-plating" additives which slow the plating as it becomes thicker, to minimize the problem of plating out on walls, and particulate within the bath.

One company in the US was famous for fabricating PCB using the additive process, (Photocircuits) and they became so smart about electroless Copper plating, they patented their chemistry, and sold licenses to use the technology they invented to the chemistry suppliers like Shipley.

Regards,

Rudy Sedlak
RD Chemical


Murulidhara <[log in to unmask]> wrote:
Dear Technetters,

Sub:Additive Process For PCB Fabrication.

We would like to know whether additive process is in use as on date for PCB Fabrication. If so, Kindly send us the details about users and the process in brief.

Thanking you in advance.

Regards,

MURULIDHARA .S
Dy.Chief Engineer,
R&D, ITI Ltd.,
Bangalore - 560 016.






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