Ramon,

Can  you indicate what the source of the tooling is? Is it exactly the
correct tooling for the terminal in question?

Another area I would look at is board thickness. Terminals have been
typically made for standard thickness of board materials such as .031,
.062, etc. I've had problems with boards coming in thinner than what the
terminal was made for. This makes the swage operation more difficult to do
without cracks and splits.

I've even used a small thin solderable washer on the turret side of a
terminal in order to have the proper thickness so the terminal will swage
properly.

Bill Kasprzak
Moog Inc
Process Engineer, Electronic Assembly



"Dehoyos, Ramon" <[log in to unmask]>
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03/28/2005 08:16 AM
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[TN] Solder Terminals






        Hi Technetters:
      I would like to know if anybody has experienced difficulties in
flaring the flange of solder terminals. On J-std-001C 6.2.3 it states that
the angle of flare shall be between 35 and 120 deg. Some terminals crack
even if they are flared at 36 deg.  Other terminals can be flared at 120
deg and not crack. I suspect that the plating finish has a lot to do with
it.
        Regards,
        Ramon

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