Hi Keld:
               I have not found any specs on under fill neither. Some use paste, but the most user friendly and repeatable is the one sided tape. It displaces gases, gives the component good mechanical strength. I believe that in the right tray it can be placed by pick and place equipment. The tape cut outs with glue towards the bottom should be placed on tray dips whose surface should have built in pins pointing up to reduce the contact surface and adhesion with the tray.
        Regards,
        Ramon




-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Keld Madsen
Sent: Tuesday, March 01, 2005 9:14 AM
To: [log in to unmask]
Subject: [TN] Underfill


Hi ng

Where do I find specifications on underfill ? I have searched various IPC
documents and cant find anything specific.
Hope some of you TechNetters can help me :-)

Best regards

:-) Keld Madsen
Quality Engineer

bb electronics manufacturing a/s
Ane Staunings Vej 21, DK 8700 Horsens
Phone: +45 76 25 10 00   Direct: +45 76 25 84 04   Fax: +45 76 25 10 30

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