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March 2005

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Subject:
Re: Micro BGA
From:
bob wettermann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, bob wettermann <[log in to unmask]>
Date:
Thu, 17 Mar 2005 03:48:51 -0800
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text/plain
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The reworking of such fine pitch devices requires: a decent rework machine with split vision and above average placement accuracy, (likely) fixturing with the ability to paste print the part itself and a knowledgeable rework tech. Such fine pitch parts are difficult to inspect for solder ball collapse and the ball/board and ball/part ball interfaces.

Bob Wettermann
BEST Inc


Bob Wettermann

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