Dewey,
that's pretty comprehensive. So, this is what I have to ask our designers to spec on the drawings? All the properties in extenso for high rel or boards with 8 layers and more (to take into acount what Guenther recommends). And for regular 6 layer and less, nothing to spec, just as for SnPb.
Also, how could I quantify good CAF resistance and improved numbers on T-288 tests?
Thanks,
Ioan
> -----Original Message-----
> From: Leadfree [SMTP:[log in to unmask]] On Behalf Of Whittaker, Dewey (AZ75)
> Sent: Monday, March 07, 2005 11:58 AM
> To: [log in to unmask]
> Subject: Re: [LF] Tg-Td
>
> We are working on new slash sheets for Lead-Free. The general consensus is
> that a non-dicey FR4 with a minimum of 155 degrees C Tg, a minimum decomp
> temperature of 340 degrees C, 0.5% moisture content, a maximum of 3.5% Z
> axis expansion, good CAF resistance and improved numbers on T-288 tests will
> work for thicker multi-layer High-Rel PWBs.
> Dewey
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]]On Behalf Of Dennis Bang
> Sent: Sunday, March 06, 2005 8:20 PM
> To: [log in to unmask]
> Subject: [LF] Tg-Td
>
>
> Dear all,
>
> I'm wondering if there is a general consensus when it comes to selecting a
> laminate material for PCBs for Lead Free. Is the standard FR4 Tg 130C
> adequate for Lead Free or would we need to move towards a higher grade
> >Tg170.
>
> I'm a little confused in that some say it is required to move to the higher
> Tg to accomodate for the higher Assembly temperature while others say Tg
> 170C is unnecessary. Are people moving towards to the higher Tg as an
> assurance or is it a requirement for the higher processing temperature?
>
>
> Kind Regards
> Dennis Bang
>
>
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