LEADFREE Archives

March 2005

Leadfree@IPC.ORG

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Subject:
From:
"Whittaker, Dewey (AZ75)" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 7 Mar 2005 09:58:00 -0700
Content-Type:
text/plain
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text/plain (66 lines)
We are working on new slash sheets for Lead-Free. The general consensus is
that a non-dicey FR4 with a minimum of 155 degrees C Tg, a minimum decomp
temperature of 340 degrees C, 0.5% moisture content, a maximum of 3.5% Z
axis expansion, good CAF resistance and improved numbers on T-288 tests will
work for thicker multi-layer High-Rel PWBs.
Dewey

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Dennis Bang
Sent: Sunday, March 06, 2005 8:20 PM
To: [log in to unmask]
Subject: [LF] Tg-Td


Dear all,

I'm wondering if there is a general consensus when it comes to selecting a
laminate material for PCBs for Lead Free. Is the standard FR4 Tg 130C
adequate for Lead Free or would we need to move towards a higher grade
>Tg170.

I'm a little confused in that some say it is required to move to the higher
Tg to accomodate for the higher Assembly temperature while others say Tg
170C is unnecessary. Are people moving towards to the higher Tg as an
assurance or is it a requirement for the higher processing temperature?


Kind Regards
Dennis Bang


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