During the IPC conference in 2004, a couple class instructors mentioned that
dross formation in some types of lead-free wave solder system could form
dross that had a density greater than the molten solder - and would
therefore sink to the bottom of the pot, making dross skimming unmanageable.

My solder reps assure me that this is not the case in SAC solder, but that
there may be some intermetallics that would sink.

Has anyone encountered this?

     Thanks,
     Mark

          M Boyd
          Pelco Engineering
          www.pelco.com


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